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LEDIA'19
The 7th International Conference on Light-Emitting Devices and Their Industrial Applications

What's New

TIME TABLE
CALL FOR PAPER

April 8, 2019
Advance Registration Deadline
March 20, 2019
Hotel Reservation Deadline
January 31, 2019
Abstract Submission Deadline

INTRODUCTION

Light-emitting diodes (LEDs) and laser diodes (LDs) have been attracting much attention for the application to solid-state lighting. In order to meet the rapid increase in the application fields, the discussion opportunities between the device developers and material scientists are required. We are pleased to announce that the 7th Conference on Light-Emitting Devices and Their Industrial Application (LEDIAf19) will be held at Pacifico Yokohama, Kanagawa, Japan, on April 23 - 25, 2019. LEDIAf19 provides a platform for scientists and engineers to discuss progress and future trends in the rapidly advancing science and technology of wide bandgap semiconductors for LEDs and their applications. Their applications into visible and ultraviolet LEDs and laser diodes (LDs) are also included in the scope of this meeting. LEDIAf19 is sponsored by Akasaki Research Center (ARC), Nagoya University.

SCOPE

LEDIAf19 covers the wide-bandgap semiconductors and LED/LD technologies in the following major topical fields;

  • Scope1@@@Light-Emitting Diodes
  • Scope2@@@Laser Diodes
  • Scope3@@@Photodetectors and Solar Cells
  • Scope4@@@Epitaxial Growths
  • Scope5@@@Extended Wavelength Devices
  • Scope6@@@Novel Fabrication Processes
  • Scope7@@@Novel Characterization Methods
  • Scope8@@@Novel Materials and Devices
  • Scope9@@@Industrial Application

Contact

Tomoyuki TANIKAWA
Secretary of LEDIA'19
Institute for Materials Research, Tohoku University
Katahira 2-1-1, Aoba-ku, Sendai 980-8577, Japan
Tel: +81 22 215 2621
E-mail: tanikawa@imr.tohoku.ac.jp

OPTICS & PHOTONICS INTERNATIONAL CONGRESS 2019iOPIC 2019j

Thirteen international conferences are going to be held simultaneously. By registering for LEDIAf19, you can participate in all international conferences.